| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board allowing a mounted semiconductor element to operate with sufficient performance and accuracy while leaving a margin.SOLUTION: A wiring board is configured to have: a pair of signal external connection pads 3S arranged adjacent to each other; a pair of grounding external connection pads 3G arranged symmetrically about a perpendicular P passing through an intermediate point of the signal external connection pads 3S; a pair of signal through hole conductors 12S arranged above the perpendicular P on both sides of the intermediate point between the signal external connection pads 3S; a pair of grounding through hole conductors 12G arranged so as to be adjacent to the signal through hole conductors 12S; a ground conductor layer 16 having an opening 16a surrounding the signal through hole conductors 12S; and a via hole conductor 15 connecting between the grounding external connection pads 3G and the ground conductor layer 16. The pair of grounding through hole conductors 12G are arranged while interposing the opening 16a therebetween. |
