| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost semiconductor device that can be manufactured easily, by laminating planar type semiconductor elements. ! SOLUTION: In a semiconductor device of the present invention, planar type semiconductor elements are laminated and a heat dissipation plate is inserted between the planar type semiconductor elements. The heat dissipation plate is provided with a projecting part on one surface thereof and provided with a flat part on the other surface thereof. The projecting part is joined to an electrode with a joining material, the electrode being provided on one surface of each planar type semiconductor element. The flat part is joined to an electrode with the joining material, the electrode being provided on the other surface of each planar type semiconductor element. ! COPYRIGHT: (C)2015,JPO&INPIT |
