发明名称 HIGH POWER SEMICONDUCTOR MODULE
摘要 The present invention relates to a power semiconductor module. A power semiconductor module according to an embodiment of the present invention includes a module housing which has a storage space and a fixing part formed on the edge of the storage space, a substrate which is formed in the housing, is exposed to the storage space, and has a circuit pattern for arranging power elements, and a terminal which is combined with the fixing part, has an input terminal for receiving power, and a lead which is boned to the circuit pattern between power elements and distributes a supplied current. Therefore, an increase in a surge voltage can be effectively prevented by balancing current distribution between the power elements to effectively reduce drift inductance.
申请公布号 KR20150062663(A) 申请公布日期 2015.06.08
申请号 KR20130147544 申请日期 2013.11.29
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KWAK, YOUNG HOON;HONG, CHANG SEOB;LEE, YOUNG KI
分类号 H01L23/04 主分类号 H01L23/04
代理机构 代理人
主权项
地址
您可能感兴趣的专利