| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip type electronic component storage mount which does not generate wrinkle or interlayer peeling during winding processing, has preferable seal property with a cover tape and a bottom tape, and which does not cause implementation trouble in an implementation step of the chip type electronic component.SOLUTION: The chip type electronic component storage mount on which a paper base material and a plastic foaming base material are stuck, is characterized in that thickness of the chip type electronic component storage mount is equal to or more than 1,100 μm, density of the foaming base material is 0.15-0.80 g/cm, and a cover tape is stuck to a surface of the paper base material. |
