COMPOSITION FOR REMOVING MATERIALS IN VIA-HOLE, METHOD FOR REMOVING MATERIALS IN VIA-HOLE AND METHOD FOR MANUFACTURING TOP EMISSION OLED PANEL USING THE SAME

摘要

The present invention relates to a composition for removing materials in via-hole, a method for removing materials in the via-hole using the same and a manufacturing method of front surface light emitting device panel wherein the manufacturing method of the front surface light emitting device panel comprises the steps of forming a lower electrode on a substrate; forming an extra wiring of an upper electrode on the substrate; and forming an insulation layer with via holes formed on the extra electrode.