| 摘要 |
PROBLEM TO BE SOLVED: To provide an Al ribbon for bonding used for bonding an electronic component built in various devices using a semiconductor and a substrate, which is inexpensive and has high dimensional accuracy, in which oxide films or residual impurities are reduced, and with which stabilized bonding can be achieved, and to provide a manufacturing method therefor.SOLUTION: An Al alloy material principally composed of Al is rolled in the thickness direction and width direction by using a reduction roll set combining a thickness direction reduction roll and a width direction reduction roll in series, and then subjected to wire drawing by means of a variant dice immediately thereafter. An Al ribbon thus obtained contains 800 ppm or less of at least one kind of Ni, Si and P, in total, has an average crystal grain size of 2-250 μm, surface roughness Ra of 2.0 μm or less, and the thickness of the oxide film of 4.0 nm or less. |
