SUBSTRATE BONDING METHOD, BUMP FORMING METHOD, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a novel substrate bonding method capable of bonding substrates in a high bonding reliability while avoiding reduction in yield aggravated due to finer-pitch.SOLUTION: A substrate bonding method includes the steps of: forming an adhesive resin layer on a surface of a first substrate on which a pad is formed; forming an opening in the adhesive resin layer on the pad; filling the opening with a molten solder to form a columnar solder bump; and heating and pressure-bonding a second substrate and the first substrate in a state where a terminal formed on the second substrate and the solder bump are aligned each other.