| 摘要 |
PROBLEM TO BE SOLVED: To provide a lid body capable of shortening the time for the process of joining between a lid body and an insulation substrate and capable of suppressing reduction of airtightness in a housing space of an electronic component. ! SOLUTION: A lid body includes: a flat plate-like substrate 10 having the lower surface and the upper surface; a metal film 2 which is provided in a frame shape in an outer peripheral part on the lower surface of the substrate 10; and a first layer 3 which is provided inside of the metal film 2 on the lower surface of the substrate 10 so as to be along the metal film 2, which contains a first metal oxide, and which absorbs an infrared ray. When heat is generated in a first layer by irradiation of the infrared ray, the heat becomes likely to be transmitted to the metal film 2, and the time required for a brazing material to reach a melting point is shortened, thereby capable of shortening the time for the process of joining between the lid body and an insulatio |
