| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad capable of preventing occurrence of abnormal noise during polishing even if a supply amount of slurry decreases and further developing an excellent polishing rate, in-plane uniformity, and step elimination property, and to provide a method for manufacturing a semiconductor device using the polishing pad.SOLUTION: There is provided a polishing pad including at least a polishing layer and a cushion layer. (1) At a cross section of a groove, at least one of two angles formed between the polishing surface and side surfaces of the groove continuous to the polishing surface is an obtuse angle, and (2) the cushion layer has a strain constant of 4.4×10μm/Pa or more and 7.5×10μm/Pa or less. |
