EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART, MANUFACTURING METHOD OF THE SAME AND PRINT CIRCUIT BOARD HAVING EMBEDDED MUTILAYER CERAMIC ELECTRONIC PART

摘要

According to an embodiment of the present invention, an embedded multilayer ceramic electronic part includes a ceramic body which includes a dielectric layer and has a first and a second main side which face each other in a thickness direction and a first and a second cross section which face each other in a length direction; a first internal electrode which is formed on the dielectric layer in the ceramic body and has a first lead exposed to the first cross section; a second internal electrode which is separated by the dielectric layer, faces the first internal electrode, and has a second lead part exposed to the second cross section; a first external electrode which is extended from the first cross section of the ceramic body to the first and the second main side; a second external electrode which is extended from the second cross section of the ceramic body to the first and the second main side; and a silane coating layer which is formed on the surface of the first and the second external electrode.