SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THEREOF

摘要

A method for manufacturing a semiconductor package according to an embodiment of the present invention includes: a step of providing a substrate with at least one ground formed inside; a step of mounting electric components on one surface of the substrate; a step of forming a mold part which seals the electric components; a step of cutting the substrate; a step of disposing a blanket along the border of the substrate; and a step of forming a conductive shield part accommodating the mold part.