| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad which exhibits high planarization efficiency and also an excellent low scratching property, and can be used for a long period of time without wear and clog.SOLUTION: A polishing pad includes a sheet, as a polishing layer, having a void ratio of 5-35% which is formed by adhering a plurality of wet-heat adhesive fibers containing wet-heat adhesive resin which exhibits adhesiveness by wet-heat treatment. Thereby, as the entire polishing pad, high hardness is maintained to maintain high planarization efficiency, and a low scratching property can be secured by decreasing an elastic modulus of the only polishing surface. |
