发明名称 METHOD FOR MANUFACTURING FLEXIBLE WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method capable of simply manufacturing a flexible wiring board at low cost, which has a flexible through wiring and a flexible circuit wiring, and has high reliability for a replication of expansion and contraction. ! SOLUTION: A method comprises: steps (S100 to S106) for forming a flexible through wiring consisting of a first flexible material and a wiring material containing a conductive material on a surface of a base of a lower mold having the base and a convex part provided on the surface of the base and/or an upper surface of the convex part; steps (S108 to S110) for forming a flexible board by filling with a second flexible material so as to surround a side surface of the flexible through wiring on the surface side of the base of the lower mold; a step (S112) for removing the lower mold from the flexible board; and a step (S114) for forming the flexible circuit board by filling the wiring material to a concave part formed on the flexible board so as to correspond
申请公布号 JP2015103766(A) 申请公布日期 2015.06.04
申请号 JP20130245617 申请日期 2013.11.28
申请人 FUJIKURA LTD 发明人 FUJIMOTO TAKUYA
分类号 H05K1/11 主分类号 H05K1/11
代理机构 代理人
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