发明名称 APPARATUS AND METHOD FOR THE MANUFACTURING OF PRINTED WIRING BOARDS AND COMPONENT ATTACHMENT
摘要 An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non- conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data.
申请公布号 WO2015081347(A1) 申请公布日期 2015.06.04
申请号 WO2014US67986 申请日期 2014.12.01
申请人 KNOX, MICHAEL;IPPOLOTI, ANDREW;KYRIAKOU, GEORGIOS;OSPINA, CARLOS;VANSNICK, NICOLAS 发明人 KNOX, MICHAEL;IPPOLOTI, ANDREW;KYRIAKOU, GEORGIOS;OSPINA, CARLOS;VANSNICK, NICOLAS
分类号 H05K3/10;H05K3/12;H05K3/20 主分类号 H05K3/10
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