SEMICONDUCTOR-PROCESSING PRESSURE-SENSITIVE ADHESIVE TAPE

摘要

　Provided is a semiconductor-processing pressure-sensitive adhesive tape provided with strong adhesion necessary when physical/mechanical peeling of a support member is to be performed, in which even if a washing fluid for washing away adhesive residue left over from when the support member was bonded to the semiconductor wafer comes into contact with a tackifier, the tackifier does not dissolve and contaminate the semiconductor element. The semiconductor-processing pressure-sensitive adhesive tape admits a laser necessary for stealth dicing such that the laser beam is radiated on the semiconductor wafer to form a modified layer, and the semiconductor wafer can be separated into semiconductor chips. This semiconductor-processing pressure-sensitive adhesive tape has a radiation-curable tackifier layer formed on at least one surface of a base material resin film, the contact angle of the pressure-sensitive adhesive layer to methyl isobutyl ketone prior to the pressure-sensitive adhesive layer being irradiated is 25.1° to 60°, and the parallel beam transmittance of light at a wavelength of 1064 nm incident from the base material resin film side is 88% or greater and less than 100%.