| 摘要 |
PROBLEM TO BE SOLVED: To suppress variation in the expansion and contraction amount of a substrate.SOLUTION: A bonding device for bonding the substrates each other includes a first holding section, a second holding section, and a control section. The first holding section suction holds a first substrate from above. The second holding section is provided below the first holding section, and suction holds a second substrate from below. After suction holding the second substrate in a second holding section, the control section releases suction holding of the second substrate by the second holding section, and then performs second substrate suction processing for suction holding the second substrate again in the second holding section. |
