| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device that has an excellent bonding reliability with an electrode pad of a mounting substrate at substrate mounting, and that can facilitate a replacement work to practical defects, such as failures after the substrate mounting.SOLUTION: A support leg part 25 supporting a semiconductor light-emitting device 1 is provided on a mounting substrate 40 at substrate mounting, and a notch 26 is provided at a position from which at least one of outer leads 30b and 31b can be visually inspected from a lateral side, of the support leg part 25. Thereby, a bonding state of solder bonding between electrode pads 41a and 41b provided on the mounting substrate 40 and the outer leads 30b and 31b of the semiconductor light-emitting device 1 can be grasped and confirmed visually from its appearance by visually inspecting a formation state of solder fillets 42a and 42b through the notch 26. |
