| 发明名称 |
CORELESS BOARD FOR SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME |
| 摘要 |
Disclosed herein are a coreless board for a semiconductor package and a method of manufacturing the same. The coreless board for the semiconductor package includes: a support; a build-up layer formed on the support; an external connection terminal formed on the build-up layer; and a solder resist layer formed on the build-up layer so as to expose the external connection terminal. |
| 申请公布号 |
US2015156865(A1) |
申请公布日期 |
2015.06.04 |
| 申请号 |
US201414199326 |
申请日期 |
2014.03.06 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE Young Kwan;KANG Myung Sam;JUNG Joo Hwan;PARK Ju Hee;KOOK Seung Yeop |
| 分类号 |
H05K1/02;H05K3/00;H05K1/11 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A coreless board for a semiconductor package, the coreless board comprising:
a support; a build-up layer formed on the support; an external connection terminal formed on the build-up layer; and a solder resist layer formed on the build-up layer so as to expose the external connection terminal. |
| 地址 |
Suwon-si KR |
