| 发明名称 |
Electronic component with sheet-like redistribution structure |
| 摘要 |
An electronic component comprising an electrically conductive chip carrier comprising an electrically insulating core structure at least partially covered with electrically conductive material, at least one electronic chip each having a first main surface attached to the chip carrier, and a sheet-like redistribution structure attached to a second main surface of the at least one electronic chip and configured for electrically connecting the second main surface of the at least one electronic chip with the chip carrier. |
| 申请公布号 |
US2015155267(A1) |
申请公布日期 |
2015.06.04 |
| 申请号 |
US201314096063 |
申请日期 |
2013.12.04 |
| 申请人 |
Infineon Technologies AG |
发明人 |
HOEGERL Juergen;Meyer-Berg Georg |
| 分类号 |
H01L25/065;H01L23/367;H01L21/78;H01L21/56;H01L25/00;H01L23/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component, the electronic component comprising:
an electrically conductive chip carrier comprising an electrically insulating core structure at least partially covered with electrically conductive material; at least one electronic chip each having a first main surface attached to the chip carrier; a sheet-like redistribution structure attached to a second main surface of the at least one electronic chip and configured for electrically connecting the second main surface of the at least one electronic chip with the chip carrier. |
| 地址 |
Neubiberg DE |
