ELECTRONIC DEVICE WITH HEAT DISSIPATION EQUIPMENT

摘要

An electronic device includes a chassis, a partition plate mounted in the chassis, a semiconductor refrigeration piece, a first heat sink, a second heat sink, a heat dissipation shell, and a fan. A space of the chassis is partitioned to a first space and a second space by the partition plate. The first heat sink is received in the first space, and engaged with a heating surface of the semiconductor refrigeration piece. The second heat sink is received in the second space, and engaged with a cooling surface of the semiconductor refrigeration piece. The heat dissipation shell is received in the second space, and the second heat sink is received in the heat dissipation shell. The first fan is mounted on a first end of the heat dissipation shell, and a second end of the heat dissipation pipe defines an air outlet.

主权项

1. An electronic device, comprising:
a chassis; a partition plate located in the chassis, and partitioning the chassis into a first space and a second space; a semiconductor refrigeration piece mounted to the partition plate, and comprising a cooling surface facing the second space, and a heating surface facing the first space; a first heat sink received in the first space and attached to the heating surface of the semiconductor refrigeration piece; a second heat sink received in the second space and attached to the cooling surface of the semiconductor refrigeration piece; a heat dissipation shell received in the second space, and defining a first air inlet in a first end of the heat dissipation shell and a first air outlet in a second end of the heat dissipation shell away from the first air inlet; and a first fan attached to the heat dissipation shell, and adjacent to and aligning with the first air inlet; wherein the second heat sink is received in the heat dissipation shell, the first fan operates to suck the air of the second space into the heat dissipation shell, the semiconductor refrigeration piece cools the second heat sink, the heat of the air received in the heat dissipation shell is transferred to the second heat sink, and the heat of the second heat sink is transferred to the first heat sink through the semiconductor refrigeration piece.