| 发明名称 |
Contactless Signal Testing |
| 摘要 |
A method for performing contactless signal testing includes receiving, with a testing pad of an integrated circuit, a signal within an electron beam, converting an electrical current created by the e-beam to a voltage with a number of diodes connected to a positive voltage supply, extracting a digital test signal from the voltage signal with a digital inverter, and passing the test signal to digital circuitry within the integrated circuit. |
| 申请公布号 |
US2015153407(A1) |
申请公布日期 |
2015.06.04 |
| 申请号 |
US201314095389 |
申请日期 |
2013.12.03 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Huang Bo-Jr;Tseng Nan-Hsin;Liu Yen-Ling |
| 分类号 |
G01R31/307;G01R1/04;G01R1/07 |
主分类号 |
G01R31/307 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for performing contactless signal testing, the method comprising:
receiving, with a testing pad of an integrated circuit, a signal within an electron beam; converting, with a number of diodes connected to a positive voltage supply, an electrical current signal created by the electron beam to a voltage signal; extracting, with a digital inverter, a test signal from the voltage signal; and passing the test signal to digital circuitry within the integrated circuit. |
| 地址 |
Hsin-Chu TW |
