发明名称 |
ADJUSTMENT OF POLISHING RATES DURING SUBSTRATE POLISHING WITH PREDICTIVE FILTERS |
摘要 |
A measured characterizing value dependent on a thickness of a region of a substrate is input into a first predictive filter. The first predictive filter generates a filtered characterizing value. A measured characterizing rate at which the measured characterizing value changes is input into a second predictive filter. The second predictive filter generates a filtered characterizing rate of the region of the substrate. The measured characterizing value and the measured characterizing rate are determined based on in-situ measurements made at or before a first time during a polishing process of the substrate. A desired characterizing rate is determined to be used for polishing the region of the substrate after the first time and before a second, later time based on the filtered characterizing value and the filtered characterizing rate. |
申请公布号 |
WO2015080863(A1) |
申请公布日期 |
2015.06.04 |
申请号 |
WO2014US65241 |
申请日期 |
2014.11.12 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
BENVEGNU, DOMINIC, J.;CHERIAN, BENJAMIN;DHANDAPANI, SIVAKUMAR;LEE, HARRY, Q. |
分类号 |
H01L21/66;H01L21/304 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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