发明名称 COOLING STRUCTURE OF ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a cooling structure of an electronic component which radiates heat generated in a ferrite core 12 in a more efficient manner.SOLUTION: A heat radiation structure radiates heat generated in a transformer 11 and has a heat transfer cooling plate 15 which contacts with a ferrite core 12 provided at the transformer 11. Slits 13a to 13d are respectively provided at four corner parts of the ferrite core 12. The heat transfer cooling plate 15 includes projection parts 21a to 21d inserted into the cutout parts 13a to 13d. The structure allows the heat generated in the ferrite core 12 to be efficiently radiated.</p>
申请公布号 JP2015103537(A) 申请公布日期 2015.06.04
申请号 JP20130240558 申请日期 2013.11.21
申请人 CALSONIC KANSEI CORP 发明人 OKAZAKI FUMIHIRO
分类号 H01F27/24;H01F30/00;H05K7/20 主分类号 H01F27/24
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