| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which is unlikely to cause mechanical and electrical damages even when being subjected to a heat treatment such as reflow, and achieves easy positioning in packaging; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device 100 comprises: a semiconductor chip 101; an insulation layer 104 provided on a principal surface 101a of the semiconductor chip 101; a wiring layer; an overcoat layer 106; a wiring pattern 105A including a connection pad provided in the wiring layer, for achieving connection with an external circuit; a base pattern 105M provided in the wiring layer; an opening 106-1 as a first opening formed at a position on the overcoat layer 106, which overlaps the connection pad and an opening 106-2 as a second opening formed at a position on the overcoat layer 106, which overlaps the base pattern 105M; a solder bump 107A as a solder terminal formed by filling the opening 106-1; and a solder part 108 for alignment formed by filling the opening 106-2.</p> |
