发明名称 TAPING DEVICE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To solve a problem in which welding surfaces cannot press a cover tape and a carrier tape on a cradle uniformly when a receiving surface of the cradle is not positioned horizontally with respect to a pair of welding surfaces of a welding head. ! SOLUTION: A cradle 20 of a taping device of an electronic component includes a pair of flat plates 24 and a pair of swingable seesaw members 26 having a pair of arm parts 26a. The pair of flat plates are positioned horizontally to a feed direction of a carrier tape and support the carrier tape, which is stored in a guide groove 22 on a top face of the cradle, from below. The pair of seesaw members 26 are positioned in a direction orthogonal to the pair of flat plates 24 below the flat plates, and the left and right arm parts 26a support the flat plates from below. The pair of flat plates 24 receive a pressing force of welding surfaces, and the seesaw members swing when the left and right arm parts 26a receive the pressing force transmitted thr
申请公布号 JP2015101365(A) 申请公布日期 2015.06.04
申请号 JP20130242491 申请日期 2013.11.25
申请人 HI-MECHA CORP 发明人 YOKOGAWA HIROKAZU
分类号 B65B15/04 主分类号 B65B15/04
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