| 发明名称 |
INTEGRATED IC PACKAGE |
| 摘要 |
An Integrated Circuit (IC) package comprises a package comprising a first set of pads having a pinout that is compatible with a chip core of a product family. A second set of pads are on substantially the same plane as the first set of pads and outside the package core. The second set of pads is configured to accommodate a circuit outside the chip core. The geometric center of the package core is different from the geometric center of the IC package. |
| 申请公布号 |
US2015156872(A1) |
申请公布日期 |
2015.06.04 |
| 申请号 |
US201314094862 |
申请日期 |
2013.12.03 |
| 申请人 |
Infineon Technologies AG |
发明人 |
OSSIMITZ Peter |
| 分类号 |
H05K1/11;H05K1/18;H05K3/10;H05K1/09 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An Integrated Circuit (IC) package, comprising:
a package core comprising a first set of pads having a pinout that is compatible with a chip core of a product family; and a second set of pads located on substantially the same plane as the first set of pads and outside the package core and configured to accommodate a circuit located outside the chip core, wherein a geometric center of the package core is different from a geometric center of the IC package. |
| 地址 |
Neubiberg DE |
