发明名称 |
LIGHT-EMITTING PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME |
摘要 |
A light-emitting package structure is provided, including an encapsulant, an light-emitting component embedded the encapsulant and having a light-emitting side and a non-emitting side opposing the light-emitting side, a dam embedded and exposed from the encapsulant, and a phosphor layer covering the light-emitting side and the dam. The non-emitting side has a plurality of electrodes. Since the heat generated by the phosphor layer can be transmitted to an outside region of the light-emitting package structure through the dam, the etiolation of the encapsulant can thus be prevented. A method of fabricating the light-emitting package structure is also provided. |
申请公布号 |
US2015155461(A1) |
申请公布日期 |
2015.06.04 |
申请号 |
US201314094063 |
申请日期 |
2013.12.02 |
申请人 |
ACHROLUX INC. |
发明人 |
Ling Peiching;Liu DeZhong |
分类号 |
H01L33/64;H01L33/54;H01L33/56;H01L33/36;H01L33/50 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
1. A light-emitting package structure, comprising:
an encapsulant having a first surface and a second surface opposing the first surface; at least one light-emitting component embedded the encapsulant, the light-emitting component having an light-emitting side exposed from the first surface of the encapsulant and a non-emitting side opposing the light-emitting side and positioned at the same side with the second surface of the encapsulant, the non-emitting side having a plurality of electrodes; at least one dam embedded the encapsulant and exposed from the first surface of the encapsulant; and a phosphor layer formed on the first surface of the encapsulant and the dam and covering the light-emitting side of the light-emitting component. |
地址 |
Sunnyvale CA US |