| 发明名称 |
MAKING AN EFUSE |
| 摘要 |
A wafer chip and a method of designing the chip is disclosed. A first fuse is formed having a first critical dimension and a second fuse having a second critical dimension are formed in a layer of the chip. A voltage may be applied to burn out at least one of the first fuse and the second fuse. The first critical dimension of the first fuse may result from applying a first mask to the layer and applying light having a first property to the mask. The second critical dimension of the second fuse may result from applying a second mask to the layer and applying light having a second property to the mask. |
| 申请公布号 |
US2015155238(A1) |
申请公布日期 |
2015.06.04 |
| 申请号 |
US201514608807 |
申请日期 |
2015.01.29 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPATION |
发明人 |
Chen Hsueh-Chung;Tseng Chiahsun;Yeh Chun-Chen;Zhao Ailian |
| 分类号 |
H01L23/525 |
主分类号 |
H01L23/525 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wafer chip, comprising:
a first fuse having a first critical dimension formed in a layer of the wafer chip; and a second fuse having a second critical dimension formed in the layer of the wafer chip; wherein the first fuse and the second fuse are configured to burn out at different applied voltages. |
| 地址 |
Armonk NY US |
