| 摘要 |
A photosensitive resin composition is provided. The photosensitive resin composition includes an alkali-soluble resin (A), a polysiloxane polymer (B), a compound (C) containing an ethylenically unsaturated group, a photoinitiator (D), and an organic solvent (E), wherein the alkali-soluble resin (A) includes an alkali-soluble resin (A-1) represented by formula 1.; |
| 主权项 |
1. A photosensitive resin composition, comprising:
an alkai-soluble resin (A); a polysiloxane polymer (B); a compound (C) containing an ethylenically unsaturated group; a photoinitiator (D); and an organic solvent (E), wherein the alkali-soluble resin (A) comprises an alkali-soluble resin (A-1) represented by formula (1), in formula (1), A represents a phenylene group, a hydrogen atom on the phenylene group can be substituted by a C1˜C5 alkyl group, a halogen atom, or a phenyl group; B represents —CO—, —SO2—, —C(CF3)2—, —Si(CH3)2—, —CH2—, —C(CH3)2—, —O—, 9,9-fluorenylidene, or a single bond; L represents a tetravalent carboxylic acid residue; Y′ represents a C1˜C20 trivalent organic group; R1, R2, and R3 are each independently a hydrogen atom, a halogen atom, or a monovalent organic group; D represents a hydrogen atom or a methyl group; and M is 1˜20. |
