发明名称 CLOSED LOOP CONTROL
摘要 A method of controlling a reactive deposition process and a corresponding assembly and/or apparatus are described. The method includes providing power to a cathode with a power supply, providing a voltage set point to the power supply, receiving a power value correlating the power provided to the cathode, and controlling a flow of a process gas in dependence of the power value to provide a closed loop control for the power value.
申请公布号 US2015152542(A1) 申请公布日期 2015.06.04
申请号 US201114357168 申请日期 2011.11.30
申请人 Deppisch Thomas;Helle Franz-Josef;Englert Manfred;Hermanns Uwe 发明人 Deppisch Thomas;Helle Franz-Josef;Englert Manfred;Hermanns Uwe
分类号 C23C14/00;C23C14/56;H01J37/34 主分类号 C23C14/00
代理机构 代理人
主权项 1. A method of controlling a reactive deposition process, comprising: providing power to a cathode with a power supply; providing a voltage set point to the power supply; receiving a power value correlating the power provided to the cathode; and controlling a flow of a process gas in dependence of the power value to provide a closed loop control.
地址 Aschaffenburg DE