Low-Melt Poly(Amic Acids) and Polyimides and their Uses

摘要

Provided are low-melt polyimides and poly(amic acids) (PAAs) for use in repair of electrical wire insulation, flat or ribbon wire harnesses, and flat surfaces comprised of high-performance polymers such as inflatables or solar panels applications. Also provided are methods and devices for repair of electrical insulation.

主权项

1. A method of forming a polyimide comprising:
reacting a dianhydride and a diamine in a polymerization reaction mixture to form a poly(amic acid) (PAA); and heating the PAA to form a polyimide; wherein (a) the dianhydride is a dianhydride of formula 1,wherein each R1 is independently H or (C1-C4)alkyl, and each R2 is independently H or (C1-C4)alkyl or CF3;
or (b) the diamine is a diamine of formula 2 or 3
H2N—(C2-C6)alkyl-[O—(C2-C6)alkyl-]nO—(C2-C6)alkyl-NH2  (2)H2N—(C2-C6)alkyl-O—Si(CH3)2-[O—Si(CH3)2-]nO—Si(CH3)2—O—(C2-C6)alkyl-NH2;  (3) wherein at least 50% by weight of reactants in the polymerization reaction mixture are a compound of formula 1, 2, or 3 or a combination thereof; wherein the method comprises reacting the diamine and dianhydride in the reaction mixture at less than 100° C. to form a PAA in solution, casting the PAA solution into a film on a substrate, and then heating the film to imidize the PAA to a polyimide.