发明名称 |
SEMICONDUCTOR RESIN COMPOSITION, SEMICONDUCTOR RESIN FILM, AND SEMICONDUCTOR DEVICE USING SAME |
摘要 |
The objective of the present invention is to obtain a semiconductor resin composition having a sufficiently low coefficient of linear expansion of the cured product thereof and a uniform distribution of inorganic particles in the direction of film thickness of a produced semi-cured film thereof. The semiconductor resin composition, which contains (a) an epoxy compound, (b) inorganic particles, (c) a polyimide, and (d) a solvent, is characterized by further containing (e) rubber particles and by the fraction of the (b) inorganic particles in the weight of the total solid fraction resulting from subtracting the weight of the (d) solvent from the total weight of the semiconductor resin composition being 60-92 wt% inclusive. |
申请公布号 |
WO2015080098(A1) |
申请公布日期 |
2015.06.04 |
申请号 |
WO2014JP81097 |
申请日期 |
2014.11.25 |
申请人 |
TORAY INDUSTRIES, INC. |
发明人 |
KANAMORI, DAISUKE;ODA, TAKURO;NONAKA, TOSHIHISA |
分类号 |
C08L63/00;C08K3/00;C08L21/00;C08L79/08;H01L21/60 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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