发明名称 |
Resistive Memory Cell Array With Top Electrode Bit Line |
摘要 |
A method for forming a resistive memory cell within a memory array includes forming a patterned stopping layer on a first metal layer formed on a substrate and forming a bottom electrode into features of the patterned stopping layer. The method further includes forming a resistive memory layer. The resistive memory layer includes a metal oxide layer and a top electrode layer. The method further includes patterning the resistive memory layer so that the top electrode layer acts as a bit line within the memory array and a top electrode of the resistive memory cell. |
申请公布号 |
US2015155488(A1) |
申请公布日期 |
2015.06.04 |
申请号 |
US201514617499 |
申请日期 |
2015.02.09 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chang Chih-Yang;Chu Wen-Ting;Tu Kuo-Chi;Chen Hsia-Wei;Liao Yu-Wen;Yang Chin-Chieh |
分类号 |
H01L45/00 |
主分类号 |
H01L45/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method for forming a resistive memory cell, the method comprising:
forming a bottom electrode on a substrate; forming a resistive memory layer over at least a portion of the bottom electrode, the resistive memory layer including:
a metal oxide layer; anda top electrode layer; and patterning the resistive memory layer so that the top electrode layer forms both a bit line within a memory array and a top electrode of the resistive memory cell. |
地址 |
Hsin-Chu TW |