发明名称 Resistive Memory Cell Array With Top Electrode Bit Line
摘要 A method for forming a resistive memory cell within a memory array includes forming a patterned stopping layer on a first metal layer formed on a substrate and forming a bottom electrode into features of the patterned stopping layer. The method further includes forming a resistive memory layer. The resistive memory layer includes a metal oxide layer and a top electrode layer. The method further includes patterning the resistive memory layer so that the top electrode layer acts as a bit line within the memory array and a top electrode of the resistive memory cell.
申请公布号 US2015155488(A1) 申请公布日期 2015.06.04
申请号 US201514617499 申请日期 2015.02.09
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Chang Chih-Yang;Chu Wen-Ting;Tu Kuo-Chi;Chen Hsia-Wei;Liao Yu-Wen;Yang Chin-Chieh
分类号 H01L45/00 主分类号 H01L45/00
代理机构 代理人
主权项 1. A method for forming a resistive memory cell, the method comprising: forming a bottom electrode on a substrate; forming a resistive memory layer over at least a portion of the bottom electrode, the resistive memory layer including: a metal oxide layer; anda top electrode layer; and patterning the resistive memory layer so that the top electrode layer forms both a bit line within a memory array and a top electrode of the resistive memory cell.
地址 Hsin-Chu TW
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