OPTOELECTRONIC CHIP-ON-BOARD MODULE

摘要

A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.

主权项

1. An optoelectronic chip-on-board module comprising:
a flat substrate populated with at least one optoelectronic component; and a transparent, UV-resistant, and temperature-resistant coating made of at least one silicone, wherein the coating comprises a dam enclosing at least a partial surface area of the flat substrate, the dam comprising a cured first silicone, and a second silicone filled in and cured in the at least partial surface area.