| 发明名称 |
METHOD OF MANUFACTURING LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE |
| 摘要 |
A method for manufacturing a light emitting device, having; a die bonding step of mounting a light emitting element on a board; a phosphor layer formation step of forming a phosphor layer that contains a phosphor by spraying on surfaces of the board and the light emitting element after the die bonding step; and a cover layer formation step of forming a cover layer that contains at least one type of light reflecting material and light blocking material on a surface of the phosphor layer over the board. |
| 申请公布号 |
US2015155447(A1) |
申请公布日期 |
2015.06.04 |
| 申请号 |
US201414554202 |
申请日期 |
2014.11.26 |
| 申请人 |
NICHIA CORPORATION |
发明人 |
BEPPU Suguru |
| 分类号 |
H01L33/50;H01L33/60;H01L33/00 |
主分类号 |
H01L33/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a light emitting device, comprising:
a die bonding step of mounting a light emitting element on a board; a phosphor layer formation step of forming a phosphor layer that contains a phosphor by spraying on surfaces of the board and the light emitting element after the die bonding step; and a cover layer formation step of forming a cover layer that contains at least one type of light reflecting material and light blocking material on a surface of the phosphor layer over the board. |
| 地址 |
Anan-shi JP |
