WIRING BOARD MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a highly efficient wiring board manufacturing method.SOLUTION: A wiring board manufacturing method comprises the steps of: depositing photosensitive thermosetting resins 3aP, 3bP each having a thickness over that of a wiring conductor 2 on an upper surface and lower surface of an insulating substrate 1, respectively, which has a semiconductor element connection pad 4 on the upper surface and an external connection pad 5 on the loser surface as a part of the wiring conductor 2; subsequently exposing the photosensitive thermosetting resin layer 3aP on the upper surface side to leave a part on the semiconductor element connection pad 4 and around the semiconductor element connection pad 4 as a non-exposed part N and exposing the photosensitive thermosetting resin layer 3bP on the lower surface side to leave a part on a central part of the external connection pad 5 as a non-exposed part N; subsequently developing the photosensitive thermosetting resin layer to thin the non-exposed part N on the upper surface side to leave a thickness thinner than a thickness of the semiconductor element connection pad 4 and to thin the non-exposed part N on the lower surface side to be left on the external connection pad 5; subsequently exposing the non-exposed part N on the upper surface side and subsequently exposing the non-exposed part N on the lower surface side so as to be completely removed; and lastly thermally curing the photosensitive thermosetting resin layers 3aP, 3bP.