| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent sticking of an impurity in cutting water to a surface of a wafer, without increasing a flow rate of the cutting water. ! SOLUTION: A cutting device (1) of the present invention comprises a chuck table (12) for holding the wafer (W), cutting means (16) for cutting the wafer on the chuck table, cutting water supply means (17) for supplying the cutting water used for cutting by the cutting means, a positive electrode (13) and a negative electrode (14) arranged so as to be electrically connected by the cutting water supplied to an upper surface of the wafer from the cutting water supply means and a power source part (15) for electrically conducting the positive electrode and the negative electrode. ! COPYRIGHT: (C)2015,JPO&INPIT |
