发明名称 |
ELECTRONIC DEVICE COOLING |
摘要 |
A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing. |
申请公布号 |
US2015156922(A1) |
申请公布日期 |
2015.06.04 |
申请号 |
US201314096653 |
申请日期 |
2013.12.04 |
申请人 |
International Business Machines Corporation |
发明人 |
Elison Bret P.;Mann Phillip V.;Moore Arden L.;Sinha Arvind K. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Armonk NY US |