| 发明名称 |
METHOD FOR MANUFACTURING AN ELECTRIC DEVICE BY CONNECTING A WIRING BOARD TO AN OBJECT AND ELECTRIC DEVICE INCLUDING A BOARD |
| 摘要 |
A method for manufacturing an electric device by connecting a wiring board to an object is disclosed. This method for manufacturing an electric device comprises: applying a wiring board having a first via hole on a mounting face of an object to fix the wiring board; placing a heater having a recess to the wiring board, the heater being adjusted so that the recess overlaps a boundary between the first via hole and a surface of the wiring board; and melting a soldering metal so that the soldering metal enters into the recess and the first via hole. |
| 申请公布号 |
US2015156885(A1) |
申请公布日期 |
2015.06.04 |
| 申请号 |
US201414555293 |
申请日期 |
2014.11.26 |
| 申请人 |
Sumitomo Electric Device Innovations, Inc. |
发明人 |
ONO Haruyoshi |
| 分类号 |
H05K1/18;H05K1/11;H05K3/34 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing an electric device, comprising:
applying a wiring board having a first via hole on a mounting face of an object to fix the wiring board; placing a heater having a recess to the wiring board, the heater being adjusted so that the recess overlaps a boundary between the first via hole and a surface of the wiring board; and melting a soldering metal so that the soldering metal enters into the recess and the first via hole. |
| 地址 |
Yokohama-shi JP |
