MECHANISMS FOR SUPPLYING PROCESS GAS INTO WAFER PROCESS APPARATUS

摘要

Embodiments of mechanisms for processing a semiconductor wafer are provided. A method for processing a wafer includes providing a wafer process apparatus. The wafer process apparatus includes a chamber and a stage positioned in the chamber for supporting the semiconductor wafer. The method also includes supplying a process gas to the semiconductor wafer via a discharged assembly that is adjacent to the stage. The discharged assembly includes a discharged passage configured without a vertical flow path section.

主权项

1. A wafer process apparatus, comprising:
a chamber; a susceptor module positioned in the chamber, wherein the susceptor module comprises a stage for supporting a semiconductor wafer and is rotatable about a rotation axis; and a discharged assembly and a fluid outlet assembly positioned at two sides of the susceptor module, wherein the discharged assembly comprises a discharged passage configured without a vertical flow path section.