发明名称 |
ULTRASONIC TRANSDUCER DEVICE, ULTRASONIC MEASUREMENT APPARATUS, AND ULTRASONIC IMAGING APPARATUS |
摘要 |
An ultrasonic transducer device includes a substrate in which a first opening and a second opening are provided, a first ultrasonic transducer element that is formed on the substrate in correspondence with the first opening, and a second ultrasonic transducer element that is formed on the substrate in correspondence with the second opening. The first opening has a first edge portion on a first direction side and a second edge portion on a second direction side, the first direction corresponding to a scan direction and the second direction being in the opposite direction to the first direction. Also, the first ultrasonic transducer element includes a first vibrating film that blocks the first opening, and a first piezoelectric layer that is provided on the first vibrating film so as to cover the first edge portion of the first opening in plan view from a thickness direction of the substrate. |
申请公布号 |
US2015151330(A1) |
申请公布日期 |
2015.06.04 |
申请号 |
US201414546403 |
申请日期 |
2014.11.18 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
TSURUNO Jiro |
分类号 |
B06B1/06;G01N29/44;G01N29/06 |
主分类号 |
B06B1/06 |
代理机构 |
|
代理人 |
|
主权项 |
1. An ultrasonic transducer device comprising:
a substrate in which a first opening and a second opening are provided; a first ultrasonic transducer element that is formed on the substrate in correspondence with the first opening; and a second ultrasonic transducer element that is formed on the substrate in correspondence with the second opening; wherein the first opening has a first edge portion on a first direction side and a second edge portion on a second direction side, the first direction corresponding to a scan direction and the second direction being in the opposite direction to the first direction, and the first ultrasonic transducer element includes: a first vibrating film that blocks the first opening; and a first piezoelectric layer that is provided on the first vibrating film so as to cover the first edge portion of the first opening in plan view from a thickness direction of the substrate. |
地址 |
Tokyo JP |