发明名称 CONTINUOUS TYPE HEATING FURNACE FOR SUBSTRATE TO BE FITTED WITH COMPONENT, AND DIE BONDER
摘要 PROBLEM TO BE SOLVED: To provide a continuous type heating furnace with a more flexible transport system, which is in particular suitable for use in a soft solder die bonder.SOLUTION: A continuous type heating furnace for a substrate comprises a heating furnace 1 which includes a channel and a transport system for the transport of the substrate 3 through the channel. The channel is bounded by a base 4, a front side wall, a rear side wall and a top part. The base 4 has a plurality of first holes 8 which are connectable to a protective gas source 9 so that protective gas can be supplied during operation. The front side wall of the channel comprises a longitudinal slit which extends parallel to a passage direction 10 thereof and is bounded by a lower edge 12 and an upper edge. The transport system comprises at least one clamp 15 for transporting the substrate 3 through the channel. The clamp 15 is movable back and forth along the longitudinal slit of the channel.
申请公布号 JP2015103803(A) 申请公布日期 2015.06.04
申请号 JP20140228580 申请日期 2014.11.11
申请人 VESI SWITZERLAND AG 发明人 GUIDO SUTER;KEVIN DOMANCICH;DANIEL ANDREAS SCHERER;RETO WEIBEL
分类号 H01L21/50;H01L21/52 主分类号 H01L21/50
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