| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a reflector material of an optical semiconductor element such as an LED, which has high heat resistance while maintaining strength and filling properties.SOLUTION: The epoxy resin composition for an optical semiconductor device contains (A) a triazine derivative epoxy resin, (B) an acid anhydride-based curing agent, (C) an inorganic filler other than a white pigment, (D) a curing accelerator, (E) a white pigment, and (F) antioxidants. The epoxy resin composition for an optical semiconductor device contains, as (F) the antioxidants, (F1) a phosphorus-based antioxidant and (F2) a hindered phenolic antioxidant. |
