发明名称 VAPOR DEPOSITION APPARATUS, FILM DEPOSITION METHOD, AND PRODUCTION METHOD FOR ORGANIC EL DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus for suppressing material deterioration in the deposition of a thin-film material so that a stable film thickness can be obtained at a desired vapor deposition rate. ! SOLUTION: A vapor deposition apparatus disposes a base material in a vacuum chamber so that a thin film material contained in a material gas fed from a material gas feed mechanism may be filmed on the base material. The material gas feed mechanism includes a vaporization part connected to an aerosol feed mechanism, and the material gas contains the vapor of the thin film material, in which the powder fed in the vaporization part from the aerosol feeding mechanism contained in the aerosol fed from the aerosol feed mechanism is gasified. The aerosol feeding mechanism includes: a powder separation part for separating the powder from the aerosol; a powder storage part for storing the powder separated and recovered; and an aerosol forming part for forming the aerosol from the powder fe
申请公布号 JP2015101770(A) 申请公布日期 2015.06.04
申请号 JP20130243885 申请日期 2013.11.26
申请人 KANEKA CORP 发明人 SHIMODATE HIROMASA ; KAWAMURA YUSUKE ; KIMURA TOSHIHIKO ; UEYAMA DAICHI
分类号 C23C14/24;H01L51/50;H05B33/10 主分类号 C23C14/24
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