PRINTED CIRCUIT BOARD

摘要

A printed circuit board (10) has: an inner layer structure (20) which, while containing at least an inner layer insulating substrate (31) consisting of a glass cloth (31a) and a resin (31b) coating the glass cloth (31a), does not contain a resin insulating substrate consisting solely of resin; an outer layer wiring (21) formed on a first face (20a) of the inner layer structure (20); and a solder resist layer (23) formed on the surface of the outer layer wiring (21). An aperture portion (11) is formed in the inner layer structure (20). The solder resist layer (23) consists of first ink portions (23a) coating at least the outer layer wiring (21) formed on a region of one portion of the first face (20a) opposing the aperture portion (11), and of second ink portions (23b) sandwiching both ends of the first ink portions (23a) and which flexibility is inferior to the flexibility of the first ink portions (23a).