| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which reduces a difference in thermal expansion amounts of each insulator layer in thermal history, thereby inhibiting warpage occurring in a substrate.SOLUTION: A wiring board A includes: multiple insulator layers 1a, 1b laminated in a vertical direction; and a ground conductor 2b and a power supply conductor 2c, where a number of circular opening parts are formed, deposited on surfaces of the insulator layers 1a, 1b. The opening parts are formed by a number of large diameter opening parts 8a arranged and small diameter opening parts 8b which are respectively disposed in areas between the large diameter opening parts 8a. |
