An adhesive composition that improves structural integrity and insulative properties when applied to a cellulosic substrate is provided. The adhesive composition includes a plurality of microspheres and an emulsion-based polymer that has (i) an elastic modulus greater than 0.5MPa in the range temperature range of 70°C to 110°C; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70°C to 110°C; and (iii) a tan d value less than 0.6 at 90°C.
申请公布号
WO2015081097(A1)
申请公布日期
2015.06.04
申请号
WO2014US67408
申请日期
2014.11.25
申请人
HENKEL US IP LLC;HUANG, TIANJIAN;THOMPSON, KRISTINA;WASKI, DANIEL;GETTY, KRIS