发明名称 SEMICONDUCTOR DEVICE
摘要 A semiconductor substrate (SUB) having recessed sections (CP1) and recessed sections (CP2), on a main surface. n+ source regions (SR) and an n+ drain region (DR) sandwich the recessed sections (CP1) and the recessed sections (CP2) in the main surface. A p- epitaxial region (EP) and p-type well regions (WL), which become channel-forming regions, are formed in the main surface between the n+ source regions (SR) and the recessed sections (CP1). Gate electrode layers (GE) are formed upon the channel areas, sandwiching a gate insulation film (GI) therebetween, and extend on top of element-separating insulation films (SI) inside the recessed sections (CP1). The recessed sections (CP1) and the recessed sections (CP2) are arranged adjacent to each other, having a substrate protruding section (CV) that protrudes further on the main surface side than the floor of each of the recessed sections (CP1, CP2), interposed therebetween.
申请公布号 WO2015079511(A1) 申请公布日期 2015.06.04
申请号 WO2013JP81838 申请日期 2013.11.27
申请人 RENESAS ELECTRONICS CORPORATION 发明人 MORI, TAKAHIRO
分类号 H01L21/336;H01L29/78 主分类号 H01L21/336
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