| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with improved reliability.SOLUTION: A semiconductor device 1 according to an embodiment comprises a wiring board 2, an electronic component 3, and a resin sealing portion 4. The wiring board 2 comprises first and second connection pads 22 and 23, and a solder resist layer 25. The electronic component 3 comprises: a first connection portion arranged along the two contour sides, facing each other, of a component body 31; and a second connection portion provided in a region including the central portion of the component body. The solder resist layer 25 is provided with: a first opening 26 that exposes the first connection pad 22; and a second opening 27 that exposes the second connection pad 23 and is opened so as to protrude to the outside of the contour sides of the component body 31. |
