| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of providing an oxide superconductive wire material capable of forming film without damaging properties of an oxide superconductive layer even by directly forming film with using a sputter method with a stabilization layer of Cu on the oxide superconductive layer, and capable of providing the oxide superconductive wire material having the stabilization layer of Cu just above the oxide superconductive layer.SOLUTION: When a stabilization layer of Cu or Cu alloy just above a laminate having an oxide superconductive layer set on a metallic substrate via an intermediate layer after conducting oxygen annealing is deposited by a sputter method, the stabilization layer of Cu or Cu alloy is formed by depositing once or several times by setting film thickness of the Cu layer or Cu alloy layer which formed at once at 2.1 μm or less. |
